Multichip Packages

Get critical features and functions to maximize your design — high performance, high quality, power efficiency, wide density ranges, small package sizes, industrial temperature ranges and more — from our broad portfolio of industry-standard multichip packages (MCPs).

Explore Micron Multichip Packages

View part catalogs, download data sheets, and find other product information.

e.MMC-Based MCP

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Benefits

Embedded managed NAND and High Performance LPDRAM in a single package
Simplified software solutions for complex high density NAND applications

Technology

e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
Densities

e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
Package

WFBGA, VFBGA, TFBGA, POP

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UFS-Based MCP (uMCP)

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Benefits

Embedded managed NAND and high-performance LPDRAM in a single package.
Enables high-density, low-power storage in a small footprint.

Technology

LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
Densities

UFS: 32GB; LPDRAM: 24Gb (3GB)
Package

WFBGA

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NAND-Based MCP

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Benefits

Offers high densities for data-intensive applications
Provides high speeds, with x8, x16 and x32 bus widths
Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles

Technology

LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
Densities

NAND: 1Gb - 8Gb
Package

WFBGA, VFBGA, TFBGA, POP

View Details Launch Part Catalog

MCPs for Embedded IoT Applications

Embedded Internet of Things (IoT) applications are expanding into numerous markets across the globe including industrial, energy, retail, transportation, home automation, healthcare, automotive and security.

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